Kingston NAND闪存芯片, 16 Gbyte, eMMC接口, BGA, 153针

不可供应
RS 不再对该产品备货。
包装方式:
RS 库存编号:
785-2338
制造商零件编号:
KE4CN4A5A
制造商:
Kingston
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品牌

Kingston

存储器大小

16 Gbyte

接口类型

eMMC

封装类型

BGA

引脚数目

153

安装类型

贴片

单元类型

NAND

长度

11.5mm

高度

1.2mm

宽度

13mm

尺寸

11.5 x 13 x 1.2mm

COO (Country of Origin):
TW

Flash eMMC,19mm - Kingston


Kingston’s 19nm Flash eMMC follows the JEDEC eMMC 4.5 standard interface. The embedded MMC controller directs the Flash management, including ECC, wear levelling, IOPS optimization and read sensing and reduces the storage management burden of the host CPU.

An ideal storage solution for many electronic devices, such as smartphones, tablet PCs, PDAs, eBook readers, MIDs, digital cameras and recorders, MP3, MP4 players, electronic learning products, digital TVs and set-top boxes. The low power and compact size makes it ideal in embedded applications, such as many Computer on Module (COM) designs.

Designed to JEDEC 4.5 specification
DDR interface
Sleep mode for power saving
Partitioning
Hardware reset
Boot operation mode
Enhanced Write Protection
Discard CMD / Sanitize CMD
Secure erase, trim and bad block erase commands
Supports HPI (High Priority Interrupt) and background operation


Flash eMMC


eMMC (embedded Multi-Media-Card) are low-profile high-density non-volatile data storage devices designed specifically for end products which need reliable data storage with low processor overhead. Although originally intended for consumer devices and designed to operate with voltages as low as 1.7V, eMMC Flash memory devices are finding applications in industrial, scientific and medical devices, especially hand-held, battery-operated or space-constrained devices. The low processor overhead frees up MCU resources making eMMC Flash memory suitable for embedded computing applications.


Based on the MMC Interface (eMMC is a trademark of the MultiMediaCard Association) Embedded, non-volatile memory system, comprised of both flash memory and a flash memory controller: ECC (Error Checking and Correcting) and Wear-leveling
Simplifies the application interface design and qualification through reduction in time-to-market and support for future flash device offerings
Frees the host processor from low-level flash memory management
Small BGA package
Specifications are managed by JEDEC